Corrosion and Protection of a Conductive Silver Paste

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dc.creator Brusic, V.
dc.creator Frankel, G. S.
dc.creator Roldan, J.
dc.creator Saraf, R. 2010-05-24T18:45:28Z 2010-05-24T18:45:28Z 1995
dc.identifier.citation Brusic, V.; Frankel, G. S.; Roldan, J.; Saraf, R. "Corrosion and Protection of a Conductive Silver Paste," Journal of the Electrochemical Society, v. 142, no. 8, 1995, pp. 2591-2594. en_US
dc.identifier.issn 0013-4651 (print)
dc.description.abstract One of the possible uses for a conductive paste is as an adhesive in interconnect technology that could replace PbSn solder. The interconnections are expected to perform under a variety of environmental conditions, and with an applied voltage. Thus knowledge of their corrosion and dissolution resistance is of utmost importance. This is a study of the dissolution and protection of polymer/metal composite films, prepared with a high loading of silver or gold particles. Electrochemical tests were conducted in a droplet of triple-distilled water with or without benzotriazole (BTA) and BTA derivatives. Results indicate that, in spite of some protection obtained by the polymer, silver paste dissolution at high anodic potentials is rapid, reaching values of 10^-1 A/cm2, which corresponds to a catastrophic silver removal rate of at least 35.6 nm/s. With a reservoir of azole in the corrosive environment, this rate can be reduced by up to five orders of magnitude. This azole effect greatly reduces the probability of electrolytic silver migration, but the Ag dissolution rate is still higher than the anodic activity shown by Au paste under the same conditions. en_US
dc.language.iso en_US en_US
dc.title Corrosion and Protection of a Conductive Silver Paste en_US
dc.type Article en_US
dc.identifier.doi 10.1149/1.2050058 Attribution-ShareAlike 3.0 Unported en_US
dc.rights.ccuri en_US
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