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Pitting of Sputtered Aluminum Alloy Thin Films

Please use this identifier to cite or link to this item: http://hdl.handle.net/1811/44522

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Title: Pitting of Sputtered Aluminum Alloy Thin Films
Creators: Frankel, G. S.; Russak, M. A.; Jahnes, C. V.; Mirzamaani, M.; Brusic, V. A.
Keywords: pitting
thin film aluminium alloys
Issue Date: 1989
Citation: Frankel, G. S.; Russak, M. A.; Jahnes, C. V.; Mirzamaani, M.; Brusic, V. A. "Pitting of Sputtered Aluminum Alloy Thin Films," Journal of the Electrochemical Society, v. 136, no. 4, 1989, pp. 1243-1244.
Abstract: Metallic films with thickness on the order of hundreds or thousands of angstroms are extensively used in the electronics industry. Due to obvious dimensional limitations, such thin films may be very susceptible to performance degradation resulting from corrosion. In this study, pitting of Al alloy thin films has been investigated. An advantage to studying thin films is that it is possible to produce alloys by thin film deposition techniques that are not easily produced by conventional metallurgical methods. Recent reports have described the exceptional pitting and corrosion resistance of thin film aluminum alloys (1-3). These alloys were metastable solid solutions produced by sputter deposition containing up to 15 atomic % solute which is far in excess of the equilibrium solubility. In this study, we have taken a similar approach to look at a wide compositional range of several Al alloys.
URI: http://hdl.handle.net/1811/44522
ISSN: 0013-4651 (print)
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